PSIM’s Thermal module lets you quickly estimate power loss calculations and compare multiple conditions and devices – without slowing down simulation speed.
The Thermal module provides a very quick way of estimating conduction and switching losses of semiconductor devices (diode, IGBT, and MOSFET). Core and winding losses for inductors was added in version 10. One major advantage of the Thermal module is that the loss calculation is done in such a way that it does not slow down the simulation. The loss calculations are thermally dependent and the junction temperature or core temperature is used by the models to reflect this dependence.
Features & Benefits
Loss Estimation, Database Editor & More
Rapid Loss Estimation
The Thermal module is ideal for quick loss estimation, and for comparing different operating conditions, or comparing devices of different manufacturers. Device conduction losses and switching losses are calculated in the simulation based on device characteristics.
Easy-to-use Device Database Editor
The Database Editor provides a convenient way to add new devices and manage existing devices. These devices can then be used in the PSIM schematic and their power losses calculated in the simulation. In addition, utility tools are provided to capture device characteristics curves directly from device datasheet images.
See what you can achieve with the Thermal module. Find more inspiration here.